features mechanical specification case: m finish: soldering temperature: 210 c maximum mounting position: any polarity: color band denotes cathode weight: 0.06 ounces (1.8 grams) o olded epoxy (ul flammability rating 94v-0) all external surfaces are silver plated for corrosion resistance superior solderability mechanical data non-repetitive peak forward surge current (half wave, single phase, 60 hz sine applied to rated load) repetitive peak reverse surge current (time constant = 10 msec duty cycle < 1.0%, tc = 25 c) o average forward rectified current maximum thermal resistance, junction to case (note 1) junction operating & storage temperature range maximum dc reverse current (v = 20v dc, tc = 25 c) r o instantaneous forward voltage (i = 100a@ 300 secpulse, t = 25 c) f c m o i r r q jc t ,t j stg 200 0.8 -65 to +175 150 800 1.05 75 volts c/w c amps na i o i rsm i fsm maximum ratings & electrical characteristics ratings at 25 c ambient temperature unless otherwise specified. single phase, half wave, 60 hz resistive or inductive load. breakdown voltage (i = 100 ma dc, tc = 25 c) r o parameter (test conditions) maximum recurrent peak reverse voltage maximum dc blocking voltage working peak reverse voltage series number v (br) v rwm v dc v rrm symbol 24 min / 32 max 23 tvs7527 ratings units volts data sheet no. TSBD-7500-1A 75 amp overvoltage transient suppressors m a f d b color ring denotes cathode tel.: (310) 767-1052 fax: (310) 767-7958 diotec electronics corp gardena, ca 90248 u.s.a 18020 hobart blvd., unit b inches millimeters min 5.94 4.19 5.46 8.43 dim a b d m f 5 nom max max 6.25 5.71 4.45 8.69 0.165 min 0.332 0.234 0.215 0.342 0.2460.225 5 nom 0.175 maximum typical 1.00 notes: 1) single side cooled 0.250" dia. die size: rohs compliant proprietary junction passivation for superior reliability and performance low forward voltage drop void free vacuum die soldering for maximum mechanical strength and heat dissipation (solder voids: typical < 2%, max. < 10% of die area) large die for high power heavy duty performance high heat handling capability with very low thermal stress inches millimeters min 5.97 4.19 5.46 9.78 dim a b d m f 5 nom max max 6.355.71 4.45 10.29 0.165 min 0.385 0.235 0.215 0.405 0.2500.225 5 nom 0.175 round
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